TIDUDW4B January   2019  – December 2024 CC2640R2F , TMP117

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TMP119
      2. 2.3.2 CC2340R5
    4. 2.4 System Design Theory
      1. 2.4.1 Shelf Life and Active Life
      2. 2.4.2 Wearer Comfort
      3. 2.4.3 System Accuracy
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Required Hardware and Software
      1. 3.1.1 Hardware
      2. 3.1.2 Software
        1. 3.1.2.1 Reading From the Patch
    2. 3.2 Testing and Results
      1. 3.2.1 Test Setup
        1. 3.2.1.1 Current Consumption and Life Span
      2. 3.2.2 Test Results
        1. 3.2.2.1 Current Consumption and Lifespan
  10. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout Recommendations
      1. 4.3.1 Layout Considerations for the CC2340R5
      2. 4.3.2 Layout Considerations for the TMP119
        1. 4.3.2.1 WCSP (YBG) Package
      3. 4.3.3 Layout Prints
    4. 4.4 Altium Project
    5. 4.5 Gerber Files
    6. 4.6 Assembly Drawings
    7. 4.7 Related Documentation
    8. 4.8 Trademarks
    9. 4.9 Revision History

3.1.2 Software

The design has an embedded firmware that must be programmed to the patch. To compile and load the embedded firmware, the following software is required:

To view the temperature from the patch or connect to the patch, the following application is required on an Android or iOS-enabled smart phone or tablet.