TIDUDW4B January   2019  – December 2024 CC2640R2F , TMP117

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TMP119
      2. 2.3.2 CC2340R5
    4. 2.4 System Design Theory
      1. 2.4.1 Shelf Life and Active Life
      2. 2.4.2 Wearer Comfort
      3. 2.4.3 System Accuracy
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Required Hardware and Software
      1. 3.1.1 Hardware
      2. 3.1.2 Software
        1. 3.1.2.1 Reading From the Patch
    2. 3.2 Testing and Results
      1. 3.2.1 Test Setup
        1. 3.2.1.1 Current Consumption and Life Span
      2. 3.2.2 Test Results
        1. 3.2.2.1 Current Consumption and Lifespan
  10. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout Recommendations
      1. 4.3.1 Layout Considerations for the CC2340R5
      2. 4.3.2 Layout Considerations for the TMP119
        1. 4.3.2.1 WCSP (YBG) Package
      3. 4.3.3 Layout Prints
    4. 4.4 Altium Project
    5. 4.5 Gerber Files
    6. 4.6 Assembly Drawings
    7. 4.7 Related Documentation
    8. 4.8 Trademarks
    9. 4.9 Revision History

WCSP (YBG) Package

The Bluetooth-Enabled High-Accuracy Skin Temperature Measurement Flex PCB Patch uses the TMP119AIYBGR to demonstrate one potential technique for measuring skin temperature. In this design, the WCSP version of the TMP119 has the coated backside placed directly against the skin of the wearer, and heat is conducted from the skin directly to the TMP119. In an end system that uses this technique the TMP119 can be covered in a soft over-molding to protect the device from damage. Figure 4-2 shows the TMP119 is located on the skin side of the patch.

TIDA-01624 TMP119AIYBGR Layout in PCB
                    Editor Figure 4-2 TMP119AIYBGR Layout in PCB Editor

This technique can be modified for applications that use enclosures but still want to measure skin temperature such as smartwatches or earbuds. The TMP119 can be placed against a metal contact to conduct heat from the wearer's skin, as shown in Figure 4-3. Alternatively, the underside of the device can be used to transfer heat as shown in Figure 4-4. If using the underside of the package, consider using a board stiffener made of a bio-compatible and thermally conductive material such as stainless steel.

TIDA-01624 Example Stack-up for External
                    Case Sensing Using Top Side of TMP119 in WCSP Package Figure 4-3 Example Stack-up for External Case Sensing Using Top Side of TMP119 in WCSP Package
TIDA-01624 Example Stackup for Sensing
                    From Underside of TMP119 in WCSP Package Figure 4-4 Example Stackup for Sensing From Underside of TMP119 in WCSP Package