TIDUE59A May 2018 – September 2020
BENJAMIN MOORE is an applications engineer at Texas Instruments, on the for SimpleLink Wi-Fi Applications team. Benjamin has been working in the Embedded Processing business unit of TI since 2013. He previously worked as part of the C2000™ and MSP430 System Applications teams. Prior to joining TI, Benjamin received his Bachelor of Science in Electrical and Computer Engineering from Ohio State University in Columbus, OH.