TIDUEU0A June   2020  – October 2020

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Power Considerations
    4. 2.4 Highlighted Products
      1. 2.4.1 Processor
      2. 2.4.2 Power Supply
      3. 2.4.3 Display
      4. 2.4.4 FPDLink Serializer
      5. 2.4.5 Input/Cameras
      6. 2.4.6 Ethernet
      7. 2.4.7 CAN
      8. 2.4.8 Class-D Amplifier
      9. 2.4.9 Other Products
        1. 2.4.9.1 Radio Tuner
        2. 2.4.9.2 Bluetooth/WiFi
        3. 2.4.9.3 GPS/GNSS
        4. 2.4.9.4 Memory
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Required Hardware and Software
      1. 3.1.1 Hardware
      2. 3.1.2 Software
    2. 3.2 Testing and Results
      1. 3.2.1 Test Setup
      2. 3.2.2 Test Results
  9. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout Recommendations
    4. 4.4 Gerber Files
    5. 4.5 Assembly Drawings
  10. 5Related Documentation
    1. 5.1 Trademarks
  11.   Revision History

4.2 Bill of Materials

To download the bill of materials (BOM), see the design files at TIDEP-01020.

For the 10-layer board, please see the following TIDEP-01020.