SBOA384 September 2020 TLV9062-Q1 , TLV9064-Q1
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This document contains information for TLV9062-Q1 (SOIC (8) and VSSOP (8) packages) and TLV9064-Q1 (TSSOP (14) and SOIC (14) packages) to aid in a functional safety system design. Information provided are:
Figure 1-1 shows the device functional block diagram for reference.
TLV9062-Q1 and TLV9064-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides Functional Safety Failure In Time (FIT) rates for the SOIC (8) package of TLV9062-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate | 9 |
Die FIT Rate | 2 |
Package FIT Rate | 7 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
4 | BICMOS Op Amp, Comparators | 8 FIT | 45°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.