This application report discusses the thermal performance of the Sitara™ AM574x series processors. The data presented demonstrates the effects of different thermal management strategies in terms of processor junction temperature and power consumption across MPU loading and ambient temperature.
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In this experiment, an internal AM574x board is used to gather thermal data with different processor loading and ambient temperature. Ambient temperature is controlled with a programmable environmental chamber.
The collected data can be utilized to correlate the thermal performance of the processor and power consumption at a given processor load and junction temperature, based on ambient temperature and thermal management.
Tests were repeated with the following thermal management: