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The AM62x (AMC) is an extension of the low-power, low-cost Sitara Industrial/Auto grade family of processors. The AM62x (AMC) is based on the Cortex-A53 microprocessor, M4F microcontroller with dedicated peripherals, 3D graphics acceleration, dual display interfaces, and extensive peripheral and networking options for a variety of embedded applications. The AM62x (AMC) is available in a 17.2-mm × 17.2-mm FBGA package with a 0.8-mm ball pitch. The package BGA design is built leveraging TI Flip Chip BGA Technology (FC-BGA) technology. This document is intended to provide a reference for escape routing on the AM62x (AMC) device. Care must be taken to route signals with special requirements such as DDR and high speed interfaces. Refer to the High-Speed Interface Layout Guidelines and DDR Routing Guidelines for more details. Details on Power Delivery Network are provided in AM62x PDN Application note and any routing and layout requirements specified in those documents supersede the generic requirements provided here.
The AM62x (AMC) solution has been designed to support the following. AM62x (AMC) package supports similar feature set as several other competition solutions with approximately 15% smaller package area and ~10% wider line width. This solution reduces PCB foot print and utilizes lower cost PCB rules, enabling compact and low-cost systems.
PCB Feature | PCB Routing Requirements |
---|---|
Minimum via diameter | 8 mils |
Via hole size | 8 mils |
Minimum trace width/spacing required in the BGA breakout | 3.2 mils / 3.7 mils |
Number of layers used for escape | 4 Layer |
BGA land pad size | 16 mils |
Package Size | 17.2 mm × 17.2 mm |
PCB layers (signal routing, total) recommended | 4, 8 |