SLOS776A September   2012  – December 2015 THS789

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Host Serial Interface DC Characteristics
    7. 6.7 Host Serial Interface AC Characteristics
    8. 6.8 Power Consumption
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Counter, Latches, Clock Multiplier
      2. 7.3.2 Channels, Interpolator
      3. 7.3.3 FIFO
      4. 7.3.4 Calibration, ALU, Tag, Shifter
      5. 7.3.5 Serial Interface, Temperature, Overhead
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial-Results Interface
      2. 7.4.2 Resister Map Descriptions for All Channels and Central Register
    5. 7.5 Programming
      1. 7.5.1 Host Processor Bus Interface
        1. 7.5.1.1  Serial Interface
        2. 7.5.1.2  Read vs Write Cycle
        3. 7.5.1.3  Parallel (Broadcast) Write
        4. 7.5.1.4  Address
        5. 7.5.1.5  Data
        6. 7.5.1.6  Reset
        7. 7.5.1.7  Chip ID
        8. 7.5.1.8  Read Operations
        9. 7.5.1.9  Write Operations
        10. 7.5.1.10 Write Operations to Multiple Destinations
      2. 7.5.2 Serial-Results Interface and ALU
        1. 7.5.2.1 Event Latches
        2. 7.5.2.2 FIFO
        3. 7.5.2.3 Result-Interface Operation
        4. 7.5.2.4 Serial Results Latency
        5. 7.5.2.5 TMU Calibration
        6. 7.5.2.6 Temperature Sensor
    6. 7.6 Register Maps
      1. 7.6.1 Register Address Space
      2. 7.6.2 Register Map Detail
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Time Measurement
        2. 8.2.2.2 Output Clock to Data/Strobe Phasing
        3. 8.2.2.3 Master Clock Input and Clock Multiplier
        4. 8.2.2.4 Temperature Measurement and Alarm Circuit
        5. 8.2.2.5 LVDS-Compatible I/Os
        6. 8.2.2.6 LVDS-Compatible Inputs
        7. 8.2.2.7 LVDS-Compatible Outputs
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

1 Features

  • Four Event Channels + Sync Channel
  • Single-Shot Accuracy: 800 ps
  • Precision: 100 ps
  • Result Interface Range: –7 to 7 s
  • Event Input Rate: 200 MHz
  • High-Speed Serial Host-Processor Bus Interface: 50 MHz
  • High-Speed LVDS-Compatible Serial-Result Bus per Channel
  • Temperature Sensor
  • Single 3.3-V Supply

2 Applications

  • Automatic Test Equipment
  • Benchtop Time-Measurement Equipment
  • Radar and Sonar
  • Medical Imaging
  • Mass Spectroscopy
  • Nuclear and Particle Physics
  • Laser Distance Measurement
  • Ultrasonic Flow Measurement

3 Description

The THS789 device is a version of the THS788 with a reduced number of features.

The THS789 is a four-channel timing measurement unit (TMU) that incorporates a time-to-digital converter (TDC) architecture for fast and accurate measurements. The TMU can provide less than
800 ps of single-shot accuracy. The TDC has 13 ps resolution (LSB), which is derived from an external master clock of 200 MHz. It uses fast LVDS-compatible interfaces for all of its event inputs and serial result outputs, which allows for fast and reliable data transfer. Each channel can process timestamps at a maximum speed of 200 MSPS.

The THS789 has a 40-bit serial-result interface that is operated at 300 MHz using single data rate clocking. The event channels can be programmed to take timestamps on rising edges or falling edges. Host programming is achieved through a 50-MHz LVCMOS interface.

The THS789 is available in a HTQFP-100 with a heat slug on top for easy heat-sink access. The device is built using TI's RF SiGe process technology, which allows for maximum timing accuracy with low power.

Device Information

PART NUMBER PACKAGE BODY SIZE (NOM)
THS789 HTQFP (100) 14.00 mm × 14.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

THS789 T0429-01_LOS616.gif