DLPS133B June   2019  – July 2024 TPS99001-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics—Analog to Digital Converter
    6. 5.6  Electrical Characteristics—Voltage Regulators
    7. 5.7  Electrical Characteristics—Temperature and Voltage Monitors
    8. 5.8  Electrical Characteristics—Current Consumption
    9. 5.9  Power-Up Timing Requirements
    10. 5.10 Power-Down Timing Requirements
    11. 5.11 Timing Requirements—Sequencer Clock
    12. 5.12 Timing Requirements—Host and Diagnostic Port SPI Interface
    13. 5.13 Timing Requirements—ADC Interface
    14. 5.14 Switching Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog to Digital Converter
        1. 6.3.1.1 Analog to Digital Converter Input Table
      2. 6.3.2 Power Sequencing and Monitoring
        1. 6.3.2.1 Power Monitoring
      3. 6.3.3 DMD Mirror Voltage Regulator
      4. 6.3.4 Low Dropout Regulators
      5. 6.3.5 System Monitoring Features
        1. 6.3.5.1 Windowed Watchdog Circuits
        2. 6.3.5.2 Die Temperature Monitors
        3. 6.3.5.3 External Clock Ratio Monitor
      6. 6.3.6 Communication Ports
        1. 6.3.6.1 Serial Peripheral Interface (SPI)
    4. 6.4 Device Functional Modes
      1. 6.4.1 OFF
      2. 6.4.2 STANDBY
      3. 6.4.3 POWERING_DMD
      4. 6.4.4 DISPLAY_RDY
      5. 6.4.5 PARKING
      6. 6.4.6 SHUTDOWN
    5. 6.5 Register Maps
      1. 6.5.1 System Status Registers
      2. 6.5.2 ADC Control
      3. 6.5.3 General Fault Status
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Headlight
        1. 7.2.1.1 Design Requirements
  9. Power Supply Recommendations
    1. 8.1 TPS99001-Q1 Power Supply Architecture
    2. 8.2 TPS99001-Q1 Power Outputs
    3. 8.3 Power Supply Architecture
  10. Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Power/High Current Signals
      2. 9.1.2 Sensitive Analog Signals
      3. 9.1.3 High-Speed Digital Signals
      4. 9.1.4 Kelvin Sensing Connections
      5. 9.1.5 Ground Separation
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
Input voltageVDD_IO to VSS_IO–0.34V
DVDD to DVSS–0.34
AVDD to DVSS–0.34
All "VSS" to other "VSS" (grounds)–0.10.1
All digital input signals to ground (WD1, WD2, ADC_MOSI, PROJ_ON, SEQ_START, SEQ_CLK, SPI1_CLK, SPI1_DIN, SPI1_SS, SPI2_DIN, SPI2_CLK, SPI2_SS, EXT_SMPL)–0.33.6
DRVR_PWR to ground–0.37.5
VIN_LDO_5V–0.37.5
V3P3V to ground–0.35
V1P8V to ground–0.35
V1P1V to ground–0.35
VIN_LDOA_3P3 to ground–0.37.5
VIN_LDOT_3P3 to ground–0.37.5
ADC_IN(7:1) to ground–0.33.6
DRST_LS_IND to DRST_PGND–0.327
VIN_DRST to ground–0.37.5
VMAIN–0.37.5
OutputsINT_Z–0.37.5V
Operating junction temperature, TJ–40130°C
Storage temperature, Tstg–65150°C

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.