SBAK019 May 2024 ADC3683-SP
The ADC3683-SP is packaged in a 64-pin QFP (TI package code HBP) ceramic package as shown in Figure 3-1. An ADC3683EVMCVAL ceramic device evaluation board was used to evaluate the performance and characteristics of the ADC3683-SP under heavy-ions.
Figure 3-2 shows the top view of the evaluation board used for the radiation testing. For more detail on the EVM used for testing, see ADC36XXEVMCVAL User's Guide.