SBAS444E May   2009  – December 2024 ADS1113 , ADS1114 , ADS1115

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   Device Comparison Table
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: I2C
    7. 5.7 Typical Characteristics
  8. 6 Parameter Measurement Information
    1. 6.1 Noise Performance
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Multiplexer
      2. 7.3.2 Analog Inputs
      3. 7.3.3 Full-Scale Range (FSR) and LSB Size
      4. 7.3.4 Voltage Reference
      5. 7.3.5 Oscillator
      6. 7.3.6 Output Data Rate and Conversion Time
      7. 7.3.7 Digital Comparator (ADS1114 and ADS1115 Only)
      8. 7.3.8 Conversion Ready Pin (ADS1114 and ADS1115 Only)
      9. 7.3.9 SMbus Alert Response
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset and Power-Up
      2. 7.4.2 Operating Modes
        1. 7.4.2.1 Single-Shot Mode
        2. 7.4.2.2 Continuous-Conversion Mode
      3. 7.4.3 Duty Cycling For Low Power
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 I2C Address Selection
        2. 7.5.1.2 I2C General Call
        3. 7.5.1.3 I2C Speed Modes
      2. 7.5.2 Target Mode Operations
        1. 7.5.2.1 Receive Mode
        2. 7.5.2.2 Transmit Mode
      3. 7.5.3 Writing To and Reading From the Registers
      4. 7.5.4 Data Format
  10. 8 Registers
    1. 8.1 Register Map
      1. 8.1.1 Address Pointer Register (address = N/A) [reset = N/A]
      2. 8.1.2 Conversion Register (P[1:0] = 00b) [reset = 0000h]
      3. 8.1.3 Config Register (P[1:0] = 01b) [reset = 8583h]
      4. 8.1.4 Lo_thresh (P[1:0] = 10b) [reset = 8000h] and Hi_thresh (P[1:0] = 11b) [reset = 7FFFh] Registers
  11. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Basic Connections
      2. 9.1.2 Single-Ended Inputs
      3. 9.1.3 Input Protection
      4. 9.1.4 Unused Inputs and Outputs
      5. 9.1.5 Analog Input Filtering
      6. 9.1.6 Connecting Multiple Devices
      7. 9.1.7 Quick-Start Guide
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Shunt Resistor Considerations
        2. 9.2.2.2 Operational Amplifier Considerations
        3. 9.2.2.3 ADC Input Common-Mode Considerations
        4. 9.2.2.4 Resistor (R1, R2, R3, R4) Considerations
        5. 9.2.2.5 Noise and Input Impedance Considerations
        6. 9.2.2.6 First-Order RC Filter Considerations
        7. 9.2.2.7 Circuit Implementation
        8. 9.2.2.8 Results Summary
      3. 9.2.3 Application Curves
  12. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequencing
    2. 10.2 Power-Supply Decoupling
  13. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  14. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  15. 13Revision History
  16. 14Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power-supply voltage VDD to GND –0.3 7 V
Analog input voltage AIN0, AIN1, AIN2, AIN3 GND – 0.3 VDD + 0.3 V
Digital input voltage SDA, SCL, ADDR, ALERT/RDY GND – 0.3 5.5 V
Input current, continuous Any pin except power supply pins –10 10 mA
Temperature Operating ambient, TA –40 125 °C
Junction, TJ –40 150
Storage, Tstg –60 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.