SBAS457F
October 2010 – September 2019
ADS1118
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
K-Type Thermocouple Measurement Using Integrated Temperature Sensor for Cold-Junction Compensation
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: Serial Interface
7.7
Switching Characteristics: Serial Interface
7.8
Typical Characteristics
8
Parameter Measurement Information
8.1
Noise Performance
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Multiplexer
9.3.2
Analog Inputs
9.3.3
Full-Scale Range (FSR) and LSB Size
9.3.4
Voltage Reference
9.3.5
Oscillator
9.3.6
Temperature Sensor
9.3.6.1
Converting from Temperature to Digital Codes
9.3.6.2
Converting from Digital Codes to Temperature
9.4
Device Functional Modes
9.4.1
Reset and Power Up
9.4.2
Operating Modes
9.4.2.1
Single-Shot Mode and Power-Down
9.4.2.2
Continuous-Conversion Mode
9.4.3
Duty Cycling for Low Power
9.5
Programming
9.5.1
Serial Interface
9.5.2
Chip Select (CS)
9.5.3
Serial Clock (SCLK)
9.5.4
Data Input (DIN)
9.5.5
Data Output and Data Ready (DOUT/DRDY)
9.5.6
Data Format
9.5.7
Data Retrieval
9.5.7.1
32-Bit Data Transmission Cycle
9.5.7.2
16-Bit Data Transmission Cycle
9.6
Register Maps
9.6.1
Conversion Register [reset = 0000h]
Table 6.
Conversion Register Field Descriptions
9.6.2
Config Register [reset = 058Bh]
Table 7.
Config Register Field Descriptions
10
Application and Implementation
10.1
Application Information
10.1.1
Serial Interface Connections
10.1.2
GPIO Ports for Communication
10.1.3
Analog Input Filtering
10.1.4
Single-Ended Inputs
10.1.5
Connecting Multiple Devices
10.1.6
Pseudo Code Example
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.3
Application Curves
11
Power Supply Recommendations
11.1
Power-Supply Sequencing
11.2
Power-Supply Decoupling
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
Device and Documentation Support
13.1
Documentation Support
13.1.1
Related Documentation
13.2
Receiving Notification of Documentation Updates
13.3
Community Resources
13.4
Trademarks
13.5
Electrostatic Discharge Caution
13.6
Glossary
14
Mechanical, Packaging, and Orderable Information
12.2
Layout Example
Figure 56.
X2QFN Package
Figure 57.
VSSOP Package