SBAS608C June   2014  – December 2015 ADS7042

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Companion Products
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Digital Voltage Levels
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Reference
      2. 10.3.2 Analog Input
      3. 10.3.3 ADC Transfer Function
      4. 10.3.4 Serial Interface
    4. 10.4 Device Functional Modes
      1. 10.4.1 Offset Calibration
        1. 10.4.1.1 Offset Calibration on Power-Up
        2. 10.4.1.2 Offset Calibration During Normal Operation
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Single-Supply DAQ with the ADS7042
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Antialiasing Filter
          2. 11.2.1.2.2 Input Amplifier Selection
          3. 11.2.1.2.3 Reference Circuit
        3. 11.2.1.3 Application Curve
      2. 11.2.2 DAQ Circuit with the ADS7042 for Maximum SINAD
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
        3. 11.2.2.3 Application Curves
      3. 11.2.3 12-Bit, 10-kSPS DAQ Circuit Optimized for DC Sensor Measurements
        1. 11.2.3.1 Design Requirements
        2. 11.2.3.2 Detailed Design Procedure
        3. 11.2.3.3 Application Curve
  12. 12Power-Supply Recommendations
    1. 12.1 AVDD and DVDD Supply Recommendations
    2. 12.2 Estimating Digital Power Consumption
    3. 12.3 Optimizing Power Consumed by the Device
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Community Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

14 Device and Documentation Support

14.1 Documentation Support

14.1.1 Related Documentation

For related documentation see the following:

14.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

14.3 Trademarks

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola.

TINA is a trademark of Texas Instruments, Inc.

All other trademarks are the property of their respective owners.

14.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

14.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.