SBAS897C March 2018 – June 2022 AMC1311-Q1
PRODUCTION DATA
THERMAL METRIC(1) | DWV (SOIC) | UNIT | |
---|---|---|---|
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 84.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 28.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 41.1 | °C/W |
ΨJT | Junction-to-top characterization parameter | 4.9 | °C/W |
ΨJB | Junction-to-board characterization parameter | 39.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |