SBASA01B September   2020  – March 2022 ADC3660

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - Power Consumption
    6. 6.6 Electrical Characteristics - DC Specifications
    7. 6.7 Electrical Characteristics - AC Specifications
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
        1. 8.3.1.1 Analog Input Bandwidth
        2. 8.3.1.2 Analog Front End Design
          1. 8.3.1.2.1 Sampling Glitch Filter Design
          2. 8.3.1.2.2 Analog Input Termination and DC Bias
            1. 8.3.1.2.2.1 AC-Coupling
            2. 8.3.1.2.2.2 DC-Coupling
        3. 8.3.1.3 Auto-Zero Feature
      2. 8.3.2 Clock Input
        1. 8.3.2.1 Single Ended vs Differential Clock Input
        2. 8.3.2.2 Signal Acquisition Time Adjust
      3. 8.3.3 Voltage Reference
        1. 8.3.3.1 Internal voltage reference
        2. 8.3.3.2 External voltage reference (VREF)
        3. 8.3.3.3 External voltage reference with internal buffer (REFBUF)
      4. 8.3.4 Digital Down Converter
        1. 8.3.4.1 DDC MUX
        2. 8.3.4.2 Digital Filter Operation
          1. 8.3.4.2.1 FS/4 Mixing with Real Output
        3. 8.3.4.3 Numerically Controlled Oscillator (NCO) and Digital Mixer
        4. 8.3.4.4 Decimation Filter
        5. 8.3.4.5 SYNC
        6. 8.3.4.6 Output Formatting with Decimation
      5. 8.3.5 Digital Interface
        1. 8.3.5.1 SDR Output Clocking
        2. 8.3.5.2 Output Data Format
        3. 8.3.5.3 Output Formatter
        4. 8.3.5.4 Output Bit Mapper
        5. 8.3.5.5 Output Interface/Mode Configuration
          1. 8.3.5.5.1 Configuration Example
      6. 8.3.6 Test Pattern
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Power Down Options
      3. 8.4.3 Digital Channel Averaging
    5. 8.5 Programming
      1. 8.5.1 Configuration using PINs only
      2. 8.5.2 Configuration using the SPI interface
        1. 8.5.2.1 Register Write
        2. 8.5.2.2 Register Read
    6. 8.6 Register Maps
      1. 8.6.1 Detailed Register Description
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
        1. 9.1.2.1 Input Signal Path
        2. 9.1.2.2 Sampling Clock
        3. 9.1.2.3 Voltage Reference
      3. 9.1.3 Application Curves
    2. 9.2 Initialization Set Up
      1. 9.2.1 Register Initialization During Operation
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Support Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6.5 Electrical Characteristics - Power Consumption

Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 105°C, ADC sampling rate = 65 MSPS, 50% clock duty cycle, AVDD = IOVDD = 1.8 V, external 1.6 V reference, 5 pF output load, and –1-dBFS differential input, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
FS = 65 MSPS
IAVDD Analog supply current FS = 65 MSPS, External reference 64 78 mA
IIOVDD I/O supply current(1) 8x real decimation, 2-wire CMOS 15 20
PDIS Power dissipation(1) External reference 142 178 mW
IIOVDD I/O supply current(1) 16x real decimation, 1-wire CMOS 14 mA
32x real decimation, 1-wire CMOS 12 mA
32x real decimation, 1/2-wire CMOS 13 mA
8x complex decimation, 2-wire CMOS 19 mA
16x complex decimation, 1-wire CMOS 17 mA
32x complex decimation, 1-wire CMOS 15
32x complex decimation, 1/2-wire CMOS 16
MISCELLANEOUS
IAVDD Internal reference, additional analog supply current Enabled via SPI 3 mA
Internal reference buffer, additional analog supply current 0.3
Single ended clock input, reduces analog supply current by 0.7
PDIS Power consumption in global power down mode Default mask settings, internal reference 5 mW
Default mask settings, external reference 9
(1) Measured with a 1 MHz input frequency full-scale sine wave at specified sample rate, with ~ 5 pF loading on each CMOS output pin.