SBASA64A December   2020  – June 2021 PCMD3140

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 6.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 6.10 Timing Requirements: PDM Digital Microphone Interface
    11. 6.11 Switching Characteristics: PDM Digial Microphone Interface
    12. 6.12 Timing Diagrams
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
      2. 7.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 7.3.3 Reference Voltage
      4. 7.3.4 Microphone Bias
      5. 7.3.5 Digital PDM Microphone Record Channel
      6. 7.3.6 Signal-Chain Processing
        1. 7.3.6.1 Programmable Digital Volume Control
        2. 7.3.6.2 Programmable Channel Gain Calibration
        3. 7.3.6.3 Programmable Channel Phase Calibration
        4. 7.3.6.4 Programmable Digital High-Pass Filter
        5. 7.3.6.5 Programmable Digital Biquad Filters
        6. 7.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 7.3.6.7 Configurable Digital Decimation Filters
          1. 7.3.6.7.1 Linear Phase Filters
            1. 7.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
            2. 7.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
            3. 7.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
            4. 7.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
            5. 7.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
            6. 7.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
            7. 7.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
            8. 7.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
            9. 7.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
          2. 7.3.6.7.2 Low-Latency Filters
            1. 7.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 7.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 7.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 7.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 7.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 7.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
          3. 7.3.6.7.3 Ultra-Low-Latency Filters
            1. 7.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 7.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 7.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 7.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 7.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 7.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
            7. 7.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 7.3.7 Voice Activity Detection (VAD)
      8. 7.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode or Software Shutdown
      2. 7.4.2 Active Mode
      3. 7.4.3 Software Reset
    5. 7.5 Programming
      1. 7.5.1 Control Serial Interfaces
        1. 7.5.1.1 I2C Control Interface
          1. 7.5.1.1.1 General I2C Operation
          2. 7.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 7.5.1.1.2.1 I2C Single-Byte Write
            2. 7.5.1.1.2.2 I2C Multiple-Byte Write
            3. 7.5.1.1.2.3 I2C Single-Byte Read
            4. 7.5.1.1.2.4 I2C Multiple-Byte Read
    6. 7.6 Register Maps
      1. 7.6.1 Page 0 Registers
      2. 7.6.2 Page 1 Registers
      3. 7.6.3 Programmable Coefficient Registers
        1. 7.6.3.1 Programmable Coefficient Registers: Page 2
        2. 7.6.3.2 Programmable Coefficient Registers: Page 3
        3. 7.6.3.3 Programmable Coefficient Registers: Page 4
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Four-Channel Digital PDM Microphone Recording
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 8.2.1.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

GUID-20201214-CA0I-QMBW-29ZG-KKFMNDXHXPWQ-low.gif Figure 5-1 RTE Package, 20-Pin WQFN With Exposed Thermal Pad, Top View
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 NC No connect No connection
2 NC No connect No connection
3 PDMDIN1_GPI1 Digital input Digital input 1 (multipurpose functions such as digital microphones data, PLL input clock source, and so forth).
4 PDMCLK_GPO1 Digital output General-purpose digital output 1 (multipurpose functions such as digital microphone clock, interrupt, and so forth).
5 VSS Ground supply Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawing at the end of this document for corner pin dimensions.
6 SDOUT Digital output Audio serial data interface bus output.
7 BCLK Digital I/O Audio serial data interface bus bit clock.
8 FSYNC Digital I/O Audio serial data interface bus frame synchronization signal.
9 IOVDD Digital supply Digital I/O power supply (1.8 V or 3.3 V, nominal).
10 VSS Ground supply Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawing at the end of this document for corner pin dimensions.
11 GPIO1 Digital I/O General-purpose digital input/output 1 (multipurpose functions such as digital microphones clock or data, PLL input clock source, interrupt, and so forth).
12 SDA Digital I/O Data pin for I2C control bus.
13 SCL Digital input Clock pin for I2C control bus.
14 DREG Digital supply Digital regulator output voltage for digital core supply (1.5 V, nominal). Connect a 10-µF and a 0.1-µF low ESR capacitor in parallel to the device ground (VSS).
15 VSS Ground supply Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawing at the end of this document for corner pin dimensions.
16 AVDD Analog supply Analog power (1.8 V or 3.3 V, nominal).
17 AREG Analog supply Analog on-chip regulator output voltage for analog supply (1.8 V, nominal) or external analog power (1.8 V, nominal). Connect a 10-µF and a 0.1-µF low ESR capacitor in parallel to the analog ground (AVSS).
18 VREF Analog Analog reference voltage filter output. Connect a 1-µF to the analog ground (AVSS).
19 PDMDIN2_GPI2 Analog output/digital input Digital Input 2. MICBIAS output or general-purpose digital input 2 (multipurpose functions such as digital microphones data, MICBIAS, PLL input clock source, and so forth). If used as MICBIAS output, then connect a 1 µF to analog ground (AVSS)
20 VSS Ground supply Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawing at the end of this document for corner pin dimensions.
Thermal Pad Thermal Pad (VSS) Ground supply Thermal pad is shorted to the internal device ground. Short the thermal pad directly to the board ground plane.