SBASA83 April 2021 AMC3336-Q1
PRODUCTION DATA
THERMAL METRIC(1) |
AMC3336-Q1 |
UNIT | |
---|---|---|---|
DWE (SOIC) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 73.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 31 | °C/W |
RθJB | Junction-to-board thermal resistance | 44 | °C/W |
ψJT | Junction-to-top characterization parameter | 16.7 | °C/W |
ψJB | Junction-to-board characterization parameter | 42.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |