SBASAK4B March   2023  â€“ April 2024 ADS127L21

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements (1.65 V ≤ IOVDD ≤ 2 V)
    7. 5.7  Switching Characteristics (1.65 V ≤ IOVDD ≤ 2 V)
    8. 5.8  Timing Requirements (2 V < IOVDD ≤ 5.5 V)
    9. 5.9  Switching Characteristics (2 V < IOVDD ≤ 5.5 V)
    10. 5.10 Timing Diagrams
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 IMD Measurement
    12. 6.12 SFDR Measurement
    13. 6.13 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input (AINP, AINN)
        1. 7.3.1.1 Input Range
      2. 7.3.2 Reference Voltage (REFP, REFN)
        1. 7.3.2.1 Reference Voltage Range
      3. 7.3.3 Clock Operation
        1. 7.3.3.1 Internal Oscillator
        2. 7.3.3.2 External Clock
      4. 7.3.4 Modulator
      5. 7.3.5 Digital Filter
        1. 7.3.5.1 Wideband Filter
          1. 7.3.5.1.1 Wideband Filter Options
          2. 7.3.5.1.2 Sinc5 Filter Stage
          3. 7.3.5.1.3 FIR1 Filter Stage
          4. 7.3.5.1.4 FIR2 Filter Stage
          5. 7.3.5.1.5 FIR3 Filter Stage
          6. 7.3.5.1.6 FIR3 Default Coefficients
          7. 7.3.5.1.7 IIR Filter Stage
            1. 7.3.5.1.7.1 IIR Filter Stability
        2. 7.3.5.2 Low-Latency Filter (Sinc)
          1. 7.3.5.2.1 Sinc3 and Sinc4 Filters
          2. 7.3.5.2.2 Sinc3 + Sinc1 and Sinc4 + Sinc1 Cascade Filter
      6. 7.3.6 Power Supplies
        1. 7.3.6.1 AVDD1 and AVSS
        2. 7.3.6.2 AVDD2
        3. 7.3.6.3 IOVDD
        4. 7.3.6.4 Power-On Reset (POR)
        5. 7.3.6.5 CAPA and CAPD
      7. 7.3.7 VCM Output Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Speed Modes
      2. 7.4.2 Idle Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Power-Down Mode
      5. 7.4.5 Reset
        1. 7.4.5.1 RESET Pin
        2. 7.4.5.2 Reset by SPI Register Write
        3. 7.4.5.3 Reset by SPI Input Pattern
      6. 7.4.6 Synchronization
        1. 7.4.6.1 Synchronized Control Mode
        2. 7.4.6.2 Start/Stop Control Mode
        3. 7.4.6.3 One-Shot Control Mode
      7. 7.4.7 Conversion-Start Delay Time
      8. 7.4.8 Calibration
        1. 7.4.8.1 OFFSET2, OFFSET1, OFFSET0 Calibration Registers (Addresses 0Ch, 0Dh, 0Eh)
        2. 7.4.8.2 GAIN2, GAIN1, GAIN0 Calibration Registers (Addresses 0Fh, 10h, 11h)
        3. 7.4.8.3 Calibration Procedure
    5. 7.5 Programming
      1. 7.5.1 Serial Interface (SPI)
        1. 7.5.1.1  Chip Select (CS)
        2. 7.5.1.2  Serial Clock (SCLK)
        3. 7.5.1.3  Serial Data Input (SDI)
        4. 7.5.1.4  Serial Data Output/Data Ready (SDO/DRDY)
        5. 7.5.1.5  SPI Frame
        6. 7.5.1.6  Full-Duplex Operation
        7. 7.5.1.7  Device Commands
          1. 7.5.1.7.1 No-Operation
          2. 7.5.1.7.2 Read Register Command
          3. 7.5.1.7.3 Write Register Command
        8. 7.5.1.8  Read Conversion Data
          1. 7.5.1.8.1 Conversion Data
          2. 7.5.1.8.2 Data Ready
            1. 7.5.1.8.2.1 DRDY
            2. 7.5.1.8.2.2 SDO/DRDY
            3. 7.5.1.8.2.3 DRDY Bit
            4. 7.5.1.8.2.4 Clock Counting
          3. 7.5.1.8.3 STATUS Byte
        9. 7.5.1.9  Daisy-Chain Operation
        10. 7.5.1.10 3-Wire SPI Mode
          1. 7.5.1.10.1 3-Wire SPI Mode Frame Reset
        11. 7.5.1.11 SPI CRC
      2. 7.5.2 Register Memory CRC
        1. 7.5.2.1 Main Program Memory CRC
        2. 7.5.2.2 FIR Filter Coefficient CRC
        3. 7.5.2.3 IIR Filter Coefficient CRC
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 SPI Operation
      2. 9.1.2 Input Driver
      3. 9.1.3 Antialias Filter
      4. 9.1.4 Reference Voltage
      5. 9.1.5 Simultaneous-Sampling Systems
    2. 9.2 Typical Applications
      1. 9.2.1 A-Weighting Filter Design
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 PGA855 Programmable Gain Amplifier
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 THS4551 Antialias Filter Design
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

7.3.5.2 Low-Latency Filter (Sinc)

The low-latency filter is a cascaded-integrator-comb (CIC) topology that minimizes the delay (latency) when conversion data propagates through the filter. The CIC filter is otherwise known as a sinc filter because of the characteristic sinx/x (sinc) frequency response. The latency time is shorter than the wideband filter, making the sinc filter designed for fast acquisition of dc signals or for use in control loops. As illustrated in Figure 7-23, the device offers programmable OSR and several sinc filter configurations: sinc3, sinc4, followed by the option of a cascaded sinc1 stage. The configurations of the sinc filter allow trade-offs between acquisition time, noise performance, and line-cycle rejection.

GUID-20230105-SS0I-5QF0-DV9L-TCLJXH8VDXKZ-low.svg Figure 7-23 Sinc Filter Bock Diagram

Equation 19 describes the general expression of the sinc-filter frequency response. For the single-stage sinc filter mode, the second stage is not used.

Equation 19. GUID-20230623-SS0I-RDGL-FWG7-FLJRBP3T113Z-low.svg

where:

  • n = Filter order of stage 1 (3 or 4)
  • A = Sinc3 or sinc4 stage OSR
  • B = Sinc1 stage OSR
  • f = Input signal frequency
  • fMOD = fCLK / 2

Latency is defined as the time from the start of the first conversion to the falling edge of DRDY. Fully settled data are available at this time. There is no need to discard data because unsettled data are suppressed by the ADC. Detailed latency data for each sinc filter mode are given in Table 7-14 and Table 7-17.

Changing the input signal while actively converting (without synchronizing to the START pin or the START bit) results in the temporary output of partially settled data. To determine the elapsed time for fully settled data to appear, round the latency time value listed in the sinc filter tables to the next whole number of conversion periods.