SBASAV2 October   2024 ADS9212

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Input Clamp Protection Circuit
        2. 6.3.1.2 Programmable Gain Amplifier (PGA)
        3. 6.3.1.3 Wide-Common-Mode Voltage Rejection Circuit
        4. 6.3.1.4 Gain Error Calibration
      2. 6.3.2 ADC Transfer Function
      3. 6.3.3 ADC Sampling Clock Input
      4. 6.3.4 Reference
        1. 6.3.4.1 Internal Reference Voltage
        2. 6.3.4.2 External Reference Voltage
      5. 6.3.5 Data Interface
        1. 6.3.5.1 Data Clock Output
        2. 6.3.5.2 ADC Output Data Randomizer
        3. 6.3.5.3 Test Patterns for Data Interface
          1. 6.3.5.3.1 Fixed Pattern
          2. 6.3.5.3.2 Digital Ramp
          3. 6.3.5.3.3 Alternating Test Pattern
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down
      2. 6.4.2 Reset
      3. 6.4.3 Initialization Sequence
      4. 6.4.4 Normal Operation
    5. 6.5 Programming
      1. 6.5.1 Register Write
      2. 6.5.2 Register Read
      3. 6.5.3 Multiple Devices: Daisy-Chain Topology for SPI Configuration
        1. 6.5.3.1 Register Write With Daisy-Chain
        2. 6.5.3.2 Register Read With Daisy-Chain
  8. 7 Register Map
    1. 7.1 Register Bank 0
    2. 7.2 Register Bank 1
    3. 7.3 Register Bank 2
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Parametric Measurement Unit (PMU)
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.7 Switching Characteristics

at AVDD_5V = 4.75V to 5.25V, VDD_1V8 = 1.75V to 1.85V, IOVDD = 1.15V to 1.85V, VREF = 4.096V (external), and maximum throughput (unless otherwise noted); minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C
PARAMETER TEST CONDITIONS MIN MAX UNIT
RESET
tPU Power-up time for device 25 ms
SPI INTERFACE TIMINGS (CONFIGURATION INTERFACE)
tden_CKDO Delay time: 8th SCLK rising edge to data enable 22 ns
tdz_CKDO Delay time: 24th SCLK rising edge to SDO going Hi-Z 50 ns
td_CKDO Delay time: SCLK falling edge to corresponding data valid on SDO 16 ns
tht_CKDO Delay time: SCLK falling edge to previous data valid on SDO 2 ns
CMOS DATA INTERFACE
tDCLK Data clock output DDR mode 10 ns
SDR mode 20
Clock duty cycle 45 55 %
toff_DCLKDO_r Time offset: DCLK rising to corresponding data valid DDR mode tDCLK / 4 – 1.5 tDCLK / 4 + 1.5 ns
toff_DCLKDO_f​ Time offset: DCLK falling to corresponding data valid DDR mode tDCLK / 4 – 1.5 tDCLK / 4 + 1.5 ns
td_DCLKDO​ Time delay: DCLK rising to corresponding data valid SDR mode –1 1 ns