SBASB12
May 2024
PCM1809
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Timing Requirements: TDM, I2S or LJ Interface
5.7
Switching Characteristics: TDM, I2S or LJ Interface
5.8
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Hardware Control
6.3.2
Audio Serial Interfaces
6.3.2.1
Time Division Multiplexed Audio (TDM) Interface
6.3.2.2
Inter IC Sound (I2S) Interface
6.3.3
Phase-Locked Loop (PLL) and Clock Generation
6.3.4
Input Channel Configurations
6.3.5
Reference Voltage
6.3.6
Signal-Chain Processing
6.3.6.1
Digital High-Pass Filter
6.3.6.2
Configurable Digital Decimation Filters
6.3.6.2.1
Linear Phase Filters
6.3.6.2.1.1
Sampling Rate: 8 kHz or 7.35 kHz
6.3.6.2.1.2
Sampling Rate: 16 kHz or 14.7 kHz
6.3.6.2.1.3
Sampling Rate: 24 kHz or 22.05 kHz
6.3.6.2.1.4
Sampling Rate: 32 kHz or 29.4 kHz
6.3.6.2.1.5
Sampling Rate: 48 kHz or 44.1 kHz
6.3.6.2.1.6
Sampling Rate: 96 kHz or 88.2 kHz
6.3.6.2.1.7
Sampling Rate: 192 kHz or 176.4 kHz
6.3.6.2.2
Low-Latency Filters
6.3.6.2.2.1
Sampling Rate: 16 kHz or 14.7 kHz
6.3.6.2.2.2
Sampling Rate: 24 kHz or 22.05 kHz
6.3.6.2.2.3
Sampling Rate: 32 kHz or 29.4 kHz
6.3.6.2.2.4
Sampling Rate: 48 kHz or 44.1 kHz
6.3.6.2.2.5
Sampling Rate: 96 kHz or 88.2 kHz
6.4
Device Functional Modes
6.4.1
Active Mode
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
8
Power Supply Recommendations
9
Layout
9.1
Layout Guidelines
9.2
Layout Example
10
Device and Documentation Support
10.1
Receiving Notification of Documentation Updates
10.2
Support Resources
10.3
Trademarks
10.4
Electrostatic Discharge Caution
10.5
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
6
Detailed Description