SBASB12 May   2024 PCM1809

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Hardware Control
      2. 6.3.2 Audio Serial Interfaces
        1. 6.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 6.3.2.2 Inter IC Sound (I2S) Interface
      3. 6.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4 Input Channel Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 Signal-Chain Processing
        1. 6.3.6.1 Digital High-Pass Filter
        2. 6.3.6.2 Configurable Digital Decimation Filters
          1. 6.3.6.2.1 Linear Phase Filters
            1. 6.3.6.2.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 6.3.6.2.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 6.3.6.2.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 6.3.6.2.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 6.3.6.2.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 6.3.6.2.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 6.3.6.2.1.7 Sampling Rate: 192 kHz or 176.4 kHz
          2. 6.3.6.2.2 Low-Latency Filters
            1. 6.3.6.2.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 6.3.6.2.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 6.3.6.2.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 6.3.6.2.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 6.3.6.2.2.5 Sampling Rate: 96 kHz or 88.2 kHz
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

PCM1809 RTE Package,20-Pin WQFN With Exposed Thermal Pad,Top ViewFigure 4-1 RTE Package,20-Pin WQFN With Exposed Thermal Pad,Top View
Table 4-1 Pin Functions
PINTYPEDESCRIPTION
NO.NAME
1IN1PAnalog inputAnalog input 1P pin.
2IN1MAnalog inputAnalog input 1M pin.
3IN2PAnalog inputAnalog input 2P pin.
4IN2MAnalog inputAnalog input 2M pin.
5VSSAnalog SupplyShort this pin directly to the board ground plane.
6SDOUTDigital outputAudio serial data interface bus output.
7BCLKDigital I/OAudio serial data interface bus bit clock.
8FSYNCDigital I/OAudio serial data interface bus frame synchronization signal.
9IOVDDDigital supplyDigital I/O power supply (1.8 V or 3.3 V, nominal).
10VSSAnalog supplyShort this pin directly to the board ground plane.
11MD1Digital inputDevice configuration mode select 1 pin.
12MD0Digital inputDevice configuration mode select 0 pin.
13MSZDigital inputAudio interface bus controller or target select pin.
14DREGDigital supplyDigital regulator output voltage for digital core supply (1.5 V, nominal).
15VSSAnalog supplyShort this pin directly to the board ground plane.
16AVDDAnalog supplyAnalog power (3.3 V, nominal).
17AREGAnalog supplyAnalog on-chip regulator output voltage for analog supply (1.8 V, nominal).
18VREFAnalogAnalog reference voltage filter output.
19FMT0Digital inputAudio interface format select pin referred to AVDD supply.
20VSSAnalog supplyShort this pin directly to the board ground plane.
Thermal Pad (VSS)Ground supplyThermal pad shorted to internal device ground. Short thermal pad directly to board ground plane.