SBASB12 May   2024 PCM1809

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Hardware Control
      2. 6.3.2 Audio Serial Interfaces
        1. 6.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 6.3.2.2 Inter IC Sound (I2S) Interface
      3. 6.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4 Input Channel Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 Signal-Chain Processing
        1. 6.3.6.1 Digital High-Pass Filter
        2. 6.3.6.2 Configurable Digital Decimation Filters
          1. 6.3.6.2.1 Linear Phase Filters
            1. 6.3.6.2.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 6.3.6.2.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 6.3.6.2.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 6.3.6.2.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 6.3.6.2.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 6.3.6.2.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 6.3.6.2.1.7 Sampling Rate: 192 kHz or 176.4 kHz
          2. 6.3.6.2.2 Low-Latency Filters
            1. 6.3.6.2.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 6.3.6.2.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 6.3.6.2.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 6.3.6.2.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 6.3.6.2.2.5 Sampling Rate: 96 kHz or 88.2 kHz
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5.7 Switching Characteristics: TDM, I2S or LJ Interface

at TA = 25°C, IOVDD = 3.3 V or 1.8 V and 20-pF load on all outputs (unless otherwise noted); see  for timing diagram
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
td(SDOUT-BCLK) BCLK to SDOUT delay 50% of BCLK to 50% of SDOUT 3 18 ns
td(SDOUT-FSYNC) FSYNC to SDOUT delay in TDM or LJ mode (for MSB data with TX_OFFSET = 0) 50% of FSYNC to 50% of SDOUT 18 ns
f(BCLK) BCLK output clock frequency: controller mode (1) 24.576 MHz
tH(BCLK) BCLK high pulse duration: controller mode 14 ns
tL(BCLK) BCLK low pulse duration: controller mode 14 ns
td(FSYNC) BCLK to FSYNC delay: controller mode 50% of BCLK to 50% of FSYNC 3 18 ns
tr(BCLK) BCLK rise time: controller mode 10% - 90% rise time 8 ns
tf(BCLK) BCLK fall time: controller mode 90% - 10% fall time 8 ns
(1) The BCLK output clock frequency must be lower than 18.5 MHz (to meet the timing specifications), if the SDOUT data line is latched on the opposite BCLK edge polarity than the edge used by the device to transmit SDOUT data.