SBASB48
June 2024
TX73H32
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Device and Documentation Support
4.1
Documentation Support
4.2
Receiving Notification of Documentation Updates
4.3
Support Resources
4.4
Trademarks
4.5
Electrostatic Discharge Caution
4.6
Glossary
5
Revision History
6
Mechanical, Packaging, and Orderable Information
6.1
Package Option Addendum
1
Features
Transmitter supports:
32-channel 3-level pulser and active transmit/ receive (T/R) switch
3-level pulser:
Maximum output voltage: ±100V
Minimum output voltage: ±1V
Maximum output current: 2A
True return to zero to discharge output to ground
Second harmonic of –40dBc at 5MHz
–3-dB Bandwidth with 220Ω || 220pF load
22MHz for a ±100V supply
Very low receive power: 0.2mW/ch
Active transmit/receive (T/R) switch with:
Turn on resistance of 13Ω
Turn on and Turn off time: 100ns
Transient glitch: 10mV
PP
On-chip beam former with:
Channel based T/R switch on and off controls
Delay resolution: half beamformer clock period, minimum 2.5ns
Maximum delay: 2
14
beamformer clock period
Maximum beamformer clockspeed: 200MHz
On-Chip RAM for pattern and delay profile
One 512 × 32 memory to store beam-former pattern and delay for a group of 2 channels
Global repeat feature present, enabling long-duration patterns
High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
Low programming time: ≈1.5µs for delay profile update
32-bit Checksum to detect wrong SPI writes
Supports CMOS serial programming interface (50MHz maximum)
High-reliability features:
Internal temperature sensor and automatic thermal shutdown
No specific power sequencing requirement
Error flag register to detect faulty conditions
Integrated passives for the floating supplies and bias voltages
Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch