SBAU425 July   2024 TMCS1127

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  6. 2Hardware
    1. 2.1 Circuitry
      1. 2.1.1 Bypass Capacitors
      2. 2.1.2 Output Filter
      3. 2.1.3 Load Connectors
      4. 2.1.4 TMCS1127 Isolated Current-Sense Amplifier
    2. 2.2 Measurements
      1. 2.2.1 Advanced Measurement Tips
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  8. 4Additional Information
    1. 4.1 Trademarks
  9. 5Related Documentation From Texas Instruments

3.3 Bill of Materials

Table 3-1 Bill of Materials for TMCS1127AEVM
DesignatorQuantityValueDescriptionPackage ReferencePart NumberManufacturer
C2_1, C2_2, C2_3, C2_4, C2_5 5 10pF CAP, CERM, 10pF, 10V, +/- 10%, X7R, 0603 603 0603ZC100KAT2A AVX
C3_1, C3_2, C3_3, C3_4, C3_5 5 0.1µF CAP, CERM, 0.1uF, 50V, +/- 10%, X7R, 0603 603 06035C104KAT2A AVX
FID1, FID2, FID3 3 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
H1_1, H1_2, H1_3, H1_4, H1_5, H2_1, H2_2, H2_3, H2_4, H2_5, H3_1, H3_2, H3_3, H3_4, H3_5, H4_1, H4_2, H4_3, H4_4, H4_5 20 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
H5, H6, H7, H8, H9 5 JUMPER W/TEST PNT 1X2PINS 2.54MM 60900213421 Würth Elektronik
LBL1, LBL2_1, LBL2_2, LBL2_3, LBL2_4, LBL2_5 6 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll PCB Label 0.650 x 0.200 inch THT-14-423-10 Brady
MP1, MP2 2 Passivated 18-8 Stainless Steel Pan Head Socket Head Screw 1/4"-20 Thread Size, 3/8" Long NPTH_SCREW_M5x0.8mm McMaster-Carr
MP3, MP4 2 Medium-Strength Steel Hex Nut NUT_1-4-20 95462A029 McMaster-Carr
R1_1, R1_2, R1_3, R1_4, R1_5 5 0 RES, 0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 RMCF0603ZT0R00 Stackpole Electronics Inc
T1_1, T2_1 2 Terminal 90A Lug CB70-14-CY CB70-14-CY Panduit
TP1_1, TP1_2, TP1_3, TP1_4, TP1_5, TP2_1, TP2_2, TP2_3, TP2_4, TP2_5, TP3_1, TP3_2, TP3_3, TP3_4, TP3_5, TP4_1, TP4_2, TP4_3, TP4_4, TP4_5, TP5_1, TP5_2, TP5_3, TP5_4, TP5_5 25 Test Point, Miniature, SMT Testpoint_Keystone_Miniature 5015 Keystone Electronics, Keystone
U1_1 1 TMCS1127A1QDVGR SOIC10 TMCS1127A1QDVGR Texas Instruments
U1_2 1 TMCS1127A2QDVGR SOIC10 TMCS1127A2QDVGR Texas Instruments
U1_3 1 TMCS1127A3QDVGR SOIC10 TMCS1127A3QDVGR Texas Instruments
U1_4 1 TMCS1127A4QDVGR SOIC10 TMCS1127A4QDVGR Texas Instruments
U1_5 1 TMCS1127A5QDVGR SOIC10 TMCS1127A5QDVGR Texas Instruments
!PCB 0 Printed Circuit Board SENS117 Any
C1_1, C1_2, C1_3, C1_4, C1_5 0 10µF CAP, CERM, 10uF, 10V, +/- 10%, X7R, 0805 805 C2012X7R1A106K125AC TDK
T1_2, T1_3, T1_4, T1_5, T2_2, T2_3, T2_4, T2_5 0 Terminal 90A Lug CB70-14-CY CB70-14-CY Panduit
Table 3-2 Bill of Materials for TMCS1127BEVM
Designator Quantity Value Description Package Reference Part Number Manufacturer
C2_1, C2_2, C2_3, C2_4, C2_5 5 10pF CAP, CERM, 10pF, 10V, +/- 10%, X7R, 0603 603 0603ZC100KAT2A AVX
C3_1, C3_2, C3_3, C3_4, C3_5 5 0.1µF CAP, CERM, 0.1uF, 50V, +/- 10%, X7R, 0603 603 06035C104KAT2A AVX
FID1, FID2, FID3 3 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
H1_1, H1_2, H1_3, H1_4, H1_5, H2_1, H2_2, H2_3, H2_4, H2_5, H3_1, H3_2, H3_3, H3_4, H3_5, H4_1, H4_2, H4_3, H4_4, H4_5 20 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
H5, H6, H7, H8, H9 5 JUMPER W/TEST PNT 1X2PINS 2.54MM 60900213421 Würth Elektronik
LBL1, LBL2_1, LBL2_2, LBL2_3, LBL2_4, LBL2_5 6 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll PCB Label 0.650 x 0.200 inch THT-14-423-10 Brady
MP1, MP2 2 Passivated 18-8 Stainless Steel Pan Head Socket Head Screw 1/4"-20 Thread Size, 3/8" Long NPTH_SCREW_M5x0.8mm McMaster-Carr
MP3, MP4 2 Medium-Strength Steel Hex Nut NUT_1-4-20 95462A029 McMaster-Carr
R1_1, R1_2, R1_3, R1_4, R1_5 5 0 RES, 0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 RMCF0603ZT0R00 Stackpole Electronics Inc
T1_1, T2_1 2 Terminal 90A Lug CB70-14-CY CB70-14-CY Panduit
TP1_1, TP1_2, TP1_3, TP1_4, TP1_5, TP2_1, TP2_2, TP2_3, TP2_4, TP2_5, TP3_1, TP3_2, TP3_3, TP3_4, TP3_5, TP4_1, TP4_2, TP4_3, TP4_4, TP4_5, TP5_1, TP5_2, TP5_3, TP5_4, TP5_5 25 Test Point, Miniature, SMT Testpoint_Keystone_Miniature 5015 Keystone Electronics, Keystone
U1_1 1 TMCS1127B1QDVGR SOIC10 TMCS1127B1QDVGR Texas Instruments
U1_2 1 TMCS1127B2QDVGR SOIC10 TMCS1127B2QDVGR Texas Instruments
U1_3 1 TMCS1127B3QDVGR SOIC10 TMCS1127B3QDVGR Texas Instruments
U1_4 1 TMCS1127B4QDVGR SOIC10 TMCS1127B4QDVGR Texas Instruments
U1_5 1 TMCS1127B5QDVGR SOIC10 TMCS1127B5QDVGR Texas Instruments
!PCB 0 Printed Circuit Board SENS117 Any
C1_1, C1_2, C1_3, C1_4, C1_5 0 10µF CAP, CERM, 10uF, 10V, +/- 10%, X7R, 0805 805 C2012X7R1A106K125AC TDK
T1_2, T1_3, T1_4, T1_5, T2_2, T2_3, T2_4, T2_5 0 Terminal 90A Lug CB70-14-CY CB70-14-CY Panduit
Table 3-3 Bill of Materials for TMCS1127CEVM
Designator Quantity Value Description Package Reference Part Number Manufacturer
C2_1, C2_2, C2_3, C2_4, C2_5 5 10pF CAP, CERM, 10pF, 10V, +/- 10%, X7R, 0603 603 0603ZC100KAT2A AVX
C3_1, C3_2, C3_3, C3_4, C3_5 5 0.1µF CAP, CERM, 0.1uF, 50V, +/- 10%, X7R, 0603 603 06035C104KAT2A AVX
FID1, FID2, FID3 3 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
H1_1, H1_2, H1_3, H1_4, H1_5, H2_1, H2_2, H2_3, H2_4, H2_5, H3_1, H3_2, H3_3, H3_4, H3_5, H4_1, H4_2, H4_3, H4_4, H4_5 20 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
H5, H6, H7, H8, H9 5 JUMPER W/TEST PNT 1X2PINS 2.54MM 60900213421 Würth Elektronik
LBL1, LBL2_1, LBL2_2, LBL2_3, LBL2_4, LBL2_5 6 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll PCB Label 0.650 x 0.200 inch THT-14-423-10 Brady
MP1, MP2 2 Passivated 18-8 Stainless Steel Pan Head Socket Head Screw 1/4"-20 Thread Size, 3/8" Long NPTH_SCREW_M5x0.8mm McMaster-Carr
MP3, MP4 2 Medium-Strength Steel Hex Nut NUT_1-4-20 95462A029 McMaster-Carr
R1_1, R1_2, R1_3, R1_4, R1_5 5 0 RES, 0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 RMCF0603ZT0R00 Stackpole Electronics Inc
T1_1, T2_1 2 Terminal 90A Lug CB70-14-CY CB70-14-CY Panduit
TP1_1, TP1_2, TP1_3, TP1_4, TP1_5, TP2_1, TP2_2, TP2_3, TP2_4, TP2_5, TP3_1, TP3_2, TP3_3, TP3_4, TP3_5, TP4_1, TP4_2, TP4_3, TP4_4, TP4_5, TP5_1, TP5_2, TP5_3, TP5_4, TP5_5 25 Test Point, Miniature, SMT Testpoint_Keystone_Miniature 5015 Keystone Electronics, Keystone
U1_1 1 TMCS1127C1QDVGR SOIC10 TMCS1127C1QDVGR Texas Instruments
U1_2 1 TMCS1127C2QDVGR SOIC10 TMCS1127C2QDVGR Texas Instruments
U1_3 1 TMCS1127C3QDVGR SOIC10 TMCS1127C3QDVGR Texas Instruments
U1_4 1 TMCS1127C4QDVGR SOIC10 TMCS1127C4QDVGR Texas Instruments
U1_5 1 TMCS1127C5QDVGR SOIC10 TMCS1127C5QDVGR Texas Instruments
!PCB 0 Printed Circuit Board SENS117 Any
C1_1, C1_2, C1_3, C1_4, C1_5 0 10µF CAP, CERM, 10uF, 10V, +/- 10%, X7R, 0805 805 C2012X7R1A106K125AC TDK
T1_2, T1_3, T1_4, T1_5, T2_2, T2_3, T2_4, T2_5 0 Terminal 90A Lug CB70-14-CY CB70-14-CY Panduit