SBOA427A August   2020  – April 2022 INA190-Q1

 

  1. 1Overview
  2. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DCK-6 Package
    2. 2.2 DDF-8 Package
  3. 3Failure Mode Distribution (FMD)
  4. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DCK-6 Package
    2. 4.2 DDF-8 Package
  5. 5Revision History

4.2 DDF-8 Package

Figure 4-2 shows the INA190-Q1 pin diagram for the DDF-8 package. For a detailed description of the device pins please refer to the 'Pin Configuration and Functions' section in the INA190-Q1 datasheet.

Figure 4-2 Pin Diagram (DDF-8 Package)
Table 4-6 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VS 1 Power supply shorted to GND. B
ENABLE 2 The device is off, the supply current is reduced, and the output is placed in a high-impedance state C
REF 3 Normal operation if REF pin is at GND potential by design; otherwise the system measurement will be incorrect. D if REF=GND by design; C otherwise
GND 4 Normal operation D
OUT 5 Output will be pulled down to GND and output current will be short circuit limited. When left in this configuration for a long time, under high supplies self-heating, which could cause die junction temperature to exceed 150°C. B
NC 6 Normal operation D
IN+ 7 In high-side configuration, a short from the bus supply to GND will occur (through RSHUNT). High current will flow from bus supply to GND. The shunt may be damaged. In low-side configuration, normal operation B for high-side; D for low-side
IN- 8 In high-side configuration, a short from the bus supply to GND will occur. B
Table 4-7 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VS1No power to device. Device may be biased through inputs. Output will be incorrect and close to GND.B
ENABLE2State of device undetermined.B
REF3Output common-mode voltage is not defined. Output will not maintain a linear relationship with differential input voltage.B
GND4When GND is floating, output will be incorrect as it is no longer referenced to GND.B
OUT5Output can be left open. There is no effect on the IC, but the output will not be measured.C
NC6Normal operationD
IN+7Shunt resistor is not connected to amplifier. IN+ pin may float to an unknown value. Output will go to an unknown value not to exceed VS or GND.B
IN-8Shunt resistor is not connected to amplifier. IN+ pin may float to an unknown value. Output will go to an unknown value not to exceed VS or GND.B
Table 4-8 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
VS 1 ENABLE The device is on and functions as a current sense amplifier. D if ENABLR=VS by design; C otherwise
ENABLE 2 REF Device mode and output voltage level will be affected D if ENABLR=REF by design; C otherwise
REF 3 GND Normal operation if REF pin is at GND potential by design; otherwise the system measurement will be incorrect. D if REF=GND by design; C otherwise
GND 4 OUT Output will be pulled down to GND and output current will be short circuit limited. When left in this configuration for a long time, under high supplies self-heating, which could cause die junction temperature to exceed 150°C. B
OUT 5 NC Normal operation D
NC 6 IN+ Normal operation D
IN+ 7 IN- Inputs shorted together, so no sense voltage applied. Output will be close to GND B
IN- 8 VS In high-side configuration, device power supply shorted to bus supply (through RSHUNT). In low-side configuration, device power supply shorted to GND.

A for high-side;

B for low-side
Table 4-9 Pin FMA for Device Pins Short-Circuited to supply
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VS 1 Normal operation. D
ENABLE 2 The device is on and functions as a current sense amplifier. D if ENABLR=VS by design; C otherwise
REF 3 Normal operation if REF pin is at VS potential by design; otherwise the system measurement will be incorrect. D if REF=VS by design; C otherwise
GND 4 Power supply shorted to GND. B
OUT 5 Output will be pulled to VS and output current will be short circuit limited. When left in this configuration for a long time, under high supplies self-heating could cause die junction temperature to exceed 150°C. B
NC 6 Normal operation D
IN+ 7 In high-side configuration, device power supply shorted to bus supply. In low-side configuration, device power supply shorted to GND (through RSHUNT).

A for high-side;

B for low-side
IN- 8 In high-side configuration, device power supply shorted to bus supply (through RSHUNT). In low-side configuration, device power supply shorted to GND.

A for high-side;

B for low-side