SBOA446 March   2021 TLV9002-Q1 , TLV9004-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC (8) Package
    2. 2.2 VSSOP (8) Package
    3. 2.3 SOIC (14) Package
    4. 2.4 SOT-23 (14) Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC (8) and VSSOP (8) Packages
    2. 4.2 SOT-23 (14) and SOIC (14) Packages

2.1 SOIC (8) Package

This section provides Functional Safety Failure In Time (FIT) rates for the SOIC (8) package of TLV9002-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours)
Total Component FIT Rate 11
Die FIT Rate 3
Package FIT Rate 8

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 100 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT

Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
4 BICMOS
Op Amp, Comparators		 8 FIT 45°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.