SBOA522 October 2021 BUF634 , BUF634A
The thermal analysis comparison between the BUF634 and BUF634A packages has shown that with proper PCB design, the thermal differences between the large BUF634 packages and smaller BUF634A packages can be mostly mitigated. In the special case of the TO-220 package with an external heatsink, it might not be possible to match equivalent performance with the BUF634A, but the smaller BUF634A packages could be used in a parallel configuration or the board designed with a backside heatsink.