SBOA603 June 2024 INA700 , INA740A , INA740B , INA745A , INA745B , INA780A , INA780B
EZShunt™ technology eliminates the need for external shunts alongside ADC’s and kelvin connection helping reduce the overall design size by 84% against traditional designs in the current market. Our device sizes vary based on voltage, and current capability.
The smallest device within this family is our INA700 which can help support 15A at 25°C ambient temperature, 40V of common Mode voltage, with an internal resistance of 2mΩ. This device is provided in a 1.2mm x 1.33mm WCSP package totaling an area of 1.637mm2. Meanwhile, the traditional external shunt design can use 10.33mm2 . Figure 2-1 shows such arrangement.
The INA745A/B, capable of 35A and 25°C ambient temperature, with an internal resistance of 0.8mΩ, and Vcm capability of 40V comes equipped with a design size of 18.44mm2 in comparison to the traditional 20mm2 illustrated by Figure 2-2.
Our INA740A/B, capable of 35A and 25°C ambient temperature, with an internal resistance of 0.8mΩ, and Vcm capability of 85V come equipped with a design size of 24mm2 in comparison to the traditional design size 24mm2 shown by Figure 2-3.
Ultimately, Our INA780A/B devices which help support 85V-110V of common mode voltage and a current rating of 75A at 25°C ambient temperature, equipped with a 0.4mΩ shunt can provide a design size of 41mm2 against the traditional 45mm2 illustrated by Figure 2-4.