SBOA606 October 2024 OPT4001-Q1
The PicoStar™ package is a piece of active silicon, without the mechanical protection of an epoxy-like package or other re-enforcement. This design allows the device to be as thin as possible. Take extra care to handle the device gently to not crack or break the device. Use a properly sized vacuum manipulation tool to handle the device.
The flex PCB needs to be handled with care once the device is soldered down to make sure the PCB does not flex in the area where the device is placed, which can put stress on the solder joints.