SBOA606 October 2024 OPT4001-Q1
The PicoStar™ package's unique ultra-small, ultra-thin device form factor enables light sensing in very space contrained designs. With the small form factor and package design comes some unique assembly considerations, which were outlined in this document. This document has covered important considerations for working with the PicoStar™ package including assembly guidelines and handling best practices to make sure of best device performance and reliability. The PicoStar™ package is available in TI's OPT3006, OPT3007, and OPT4001 devices.