SBOK029D April   2018  – November 2023 TMP461-SP

 

  1.   1
  2.   TMP461-SP Single-Event Effects (SEE) Radiation Test Report
  3.   Trademarks
  4. 1Overview
  5. 2SEE Mechanisms
  6. 3Test Device and Test Board Information
  7. 4Irradiation Facility and Setup
  8. 5Results
    1. 5.1 SEL Results
    2. 5.2 SET Results
    3. 5.3 Event Rate Calculations
  9. 6Summary
  10.   A Confidence Interval Calculations
  11.   B References
  12.   Revision History

1 Overview

The TMP461-SP device is a radiation-hardened, high-accuracy, low-power remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensors are typically low-cost discrete NPN or PNP transistors, or substrate thermal transistors or diodes that are integral parts of microprocessors, analog-to-digital converters (ADC), digital-to-analog converters (DAC), microcontrollers, or field-programmable gate arrays (FPGA). Temperature is represented as a 12-bit digital code for both local and remote sensors, giving a resolution of 0.0625°C. The two-wire serial interface accepts the SMBus communication protocol with up to nine different pin-programmable addresses.

Table 1-1 lists general device information and test conditions. For more detailed technical specifications, user-guides, and application notes, see http://www.ti.com/product/TMP461-SP/technicaldocuments.

Table 1-1 Overview Information
DESCRIPTIONDEVICE INFORMATION(1)
TI Part NumberTMP461-SP
SMD Number5962-1721801VXC
Device FunctionRemote and Local Digital Temperature Sensor
TechnologyLBC8LV
Exposure FacilityRadiation Effects Facility, Cyclotron Institute, Texas A&M University
Heavy Ion Fluence per Run1 × 106 – 1 × 107 ions/cm2
Irradiation Temperature25°C and 125°C (for SEL Testing)
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