SBOK029D April 2018 – November 2023 TMP461-SP
3 Test Device and Test Board Information
The TMP461-SP is packaged in a 10-pin, thermally-enhanced, dual ceramic flat pack package (CFP) shown with pinout in Figure 3-1. The TMP461 evaluation board used for the SEE characterization is shown in Figure 3-2 and schematics are shown in Figure 3-3.
The package lid was removed to reveal the die face for all heavy ion testing.
Figure 3-1 TMP461-SP HKU (CFP, 10) Pinout Diagram
Figure 3-2 TMP461EVM-CVAL Temperature Sensor Evaluation Module Board
Figure 3-3 Schematic of TMP461EVM-CVAL Evaluation Board Used to Perform the SEE