SBOK050 November   2023 OPA4H014-SEP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Device Information
  5. 2Texas Instruments Enhanced Product Qualification and Reliability Report
  6. 3Space Enhanced Plastic Production Flow
  7. 4Qualification by Similarity (Qualification Family)
  8. 5Outgas Test Report

4 Qualification by Similarity (Qualification Family)

A new device can be qualified either by performing full scale quality and reliability test on the actual device or using previously qualified device(s) through "Qualification by Similarity" (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive test will be eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration. The QBS rules for a technology, product, test parameter or package shall define which attributes are required to remain fixed in order for the QBS rules to apply. The attributes which are expected and allowed to vary will be reviewed and a QBS plan shall be developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device shall be reviewed for the conformance to the QBS rule sets applicable to the device. See JEDEC JESD47 for more information.

Table 4-1 Device Baseline 1
TI DeviceOPA4H014-SEPAssembly SiteTI Malaysia
DLA VID:V62/21607Test Site:TI Malaysia
Wafer Fab:TI FFABPin/Package Type:TSSOP (PW) |14
Fab Process:BICOM-3XHVLeadframe:Cu
Fab Technology:BICMOSTermination Finish:NiPdAu
Die Revision:CBond Wire:24.4 µm Au
ESD CDM:±500 VMoisture Sensitivity:MSL 2 / 260°C
ESD HBM:±2000 V
  1. Baseline information in effect as of the date of this report.
Table 4-2 Space Enhanced Products New Device Qualification Matrix 1
Description Condition Sample Size Used and Rejects Lots Required Test Method
Electromigration Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Wire Bond Life Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Electrical Characterization TI Data Sheet 10 3 N/A
Electrostatic Discharge Sensitivity HBM 3 units/voltage 1 EIA/JESD22-A114
CDM EIA/JESD22-C101
Latch-up Per Technology 3/0 1 EIA/JESD78
Physical Dimensions TI Data Sheet 5/0 1 EIA/JESD22- B100
Thermal Impedance Theta-JA on board Per Pin-Package N/A EIA/JESD51
Bias Life Test 125°C / 1000 hours or equivalent 77/0 3 JESD22-A108 (2)
Biased HAST 130°C / 85% / 96 hours 77/0 3 JESD22-A1102
Extended Biased HAST 130°C / 85% / 250 hours (for reference) 77/0 1 JESD22-A1102
Unbiased HAST 130°C / 85% / 96 hours 77/0 3 JESD22-A1102
Temperature Cycle -65°C to +150°C non-biased for 500 cycles 77/0 3 JESD22-A1042
Solder Heat 260°C for 10 seconds 22/0 1 JESD22-B106
Resistance to Solvents Ink symbol only 12/0 1 JESD22-B107
Solderability Condition A (steam age for 8 hours) 22/0 1 ANSI/J-STD-002-92
Flammability Method A / Method B 5/0 1 UL-1964
Bond Shear Per wire size 5 units × 30/0 bonds 3 JESD22-B116
Bond Pull Strength Per wire size 5 units × 30/0 bonds 3 ASTM F-459
Die Shear Per die size 5/0 3 TM 2019
High Temp Storage 150 °C / 1,000 hours 15/0 3 JESD22-A103-A2
Moisture Sensitivity Surface Mount Only 12 1 J-STD-020-A2
Radiation Response Characterization Total Ionization Dose, and Single-Event Latchup 5 units/dose level 1 MIL-STD-883/Method 1019
Outgassing Characterization TML (Total Mass Lost), CVCM (Collected Volatile Condensable material), WVR (Water vapor recorded) 5 1 ASTM E595
  1. Note that qualification by similarity (“qualification family”) per JEDEC JESD47 is allowed.
  2. Precondition performed per JEDEC Std. 22, Method A112/A113.