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TI qualification testing is a risk mitigation process that is engineered to assure device longevity in customer applications. Wafer fabrication process and package level reliability are evaluated in a variety of ways that may include accelerated environmental test conditions with subsequent derating to actual use conditions. Manufacturability of the device is evaluated to verify a robust assembly flow and assure continuity of supply to customers. TI Enhanced Products are qualified with industry standard test methodologies performed to the intent of Joint Electron Devices Engineering Council (JEDEC) standards and procedures. Texas Instruments Enhanced Products are certified to meet GEIA-STD-0002-1 Aerospace Qualified Electronic Components.
OPA4H199-SEP is a radiation hardened device in a plastic package which allows this device to be used in space applications. The device was verified immune to 43 MeV·cm2/mg at 125°C for single event latch-up (SEL). Each fabrication lot was tested according to MIL-STD-883 for Radiation Lot Acceptance Tested (RLAT) up to 30 krad(Si) and each assembly and test lot follows the process flow shown in Figure 4-1 To ensure the quality of OPA4H199-SEP, it is qualified with Space EP requirements. See Section 5 for further details.