SBOK086 December   2024 TRF0208-SEP

 

  1.   1
  2.   2
  3.   Trademarks
  4. 1 Overview
  5. 2 Single-Event Effects
  6. 3 Test Device and Evaluation Board Information
  7. 4 Irradiation Facility and Setup
  8. 5 Depth, Range, and LETEFF Calculation
  9. 6 Test Set-Up and Procedures
  10. 7 Single-Event Latch-up (SEL) Results
  11. 8 Single-Event Transients (SET) Results
  12. 9 Event Rate Calculations
  13. 10Summary
  14.   A Total Ionizing Dose from SEE Experiments
  15.   B Confidence Interval Calculations
  16.   C References

6 Test Set-Up and Procedures

SEE testing was performed on a TRF0208-SEP device mounted on a TRF0208SEP-EVM. The device was provided power through J1 input (+SUPPLY = +3.45 V and GND) using the PXIe-4139 precision power supply in a 4-wire configuration. The TRF0208-SEP was evaluated with AC input signal provided on the INP input (J4). For the AC test, the input was driven onto the INP pin (J4) with R&S SME03 signal generator (capable of providing a 3GHz signal) using a high speed coaxial cable. Input frequency was set to 100MHz (most used), 500MHz, and 1GHz, the input amplitude was set in such way that the output was set to 800mVP-P. Also during all time the PD pin (J9 jumper) was connected to GND.

The device was evaluated in differential mode. SETs where monitored using a Mixed Signal Oscilloscope, MSO58B (8 channel, 1GHz, 6.25GS/s, 62.5M record length). The differential output of the TRF0208-SEP is converted to single ended by using an Hyperlabs HL9402 balun and was monitored.

The power supply (PS) was controlled and monitored using a custom-developed LabView™ program (PXI-RadTest) running on a NI-PXIe-8135 controller. The R&S SME03 was controlled via the GPIB bus, using the stand alone LabView™ drivers. The MSO58B was controlled using its front-panel interface. The MSO was left in the cave at all times, to minimize the probe cable length. A keyboard, video, and mouse (KVM) extender was used to control and view the MSO from the control room at TAMU. A block diagram of the setup used for SEE testing the TRF0208-SEP is illustrated in Figure 6-1. Equipment settings and compliances used during the characterization are shown in Table 6-1. For the SEL testing the device was heated using a convection heat gun aimed at the die. The junction temperature was monitored by using a K-type thermocouple attached as close as possible to the die.

Table 6-1 Equipment Setup and Parameters Used for SEE Testing the TRF0208-SEP
Pin NameEquipment UsedCapabilityComplianceRange of Values Used
VDD (J1)NI PXIe-41393A3A3.3V, 3.45V, 3.7V
INP (J4)R&S SME035KHz-3GHz—100MHz, 500MHz, 1GHz
OUTP (J6) and OUTM (J5)Tektronix MSO58B6.25GS/S—6.25 GS/s

All boards used for SEE testing were fully checked for functionality and dry runs performed to ensure that the test system was stable under all bias and load conditions prior to being taken to the TAMU facility. During the heavy-ion testing, the LabView™ control program powered up the TRF0208-SEP device and set the external sourcing and monitoring functions of the external equipment. After functionality and stability had been confirmed, the beam shutter was opened to expose the device to the heavy-ion beam. The shutter remained open until the target fluence was achieved (determined by external detectors and counters).

Block Diagram of the Test Setup Used for the TRF0208-SEP Mounted on a TRF0208SEP-EVM SEE CharacterizationFigure 6-1 Block Diagram of the Test Setup Used for the TRF0208-SEP Mounted on a TRF0208SEP-EVM SEE Characterization