SBOS165B September 2000 – April 2024 OPA627 , OPA637
PRODMIX
THERMAL METRIC(1) | OPA637 | UNIT | ||
---|---|---|---|---|
D (SOIC) | LMC (TO-99) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 107.9 | 200 | ℃/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 57.3 | N/A | ℃/W |
RθJB | Junction-to-board thermal resistance | 49.7 | N/A | ℃/W |
ψJT | Junction-to-top characterization parameter | 11.7 | N/A | ℃/W |
ψJB | Junction-to-board characterization parameter | 48.9 | N/A | ℃/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | ℃/W |