SBOS629A April 2018 – July 2018 OPA858
PRODUCTION DATA.
THERMAL METRIC(1) | OPA858 | UNIT | |
---|---|---|---|
DSG (WSON) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 80.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 100 | °C/W |
RθJB | Junction-to-board thermal resistance | 45 | °C/W |
ψJT | Junction-to-top characterization parameter | 6.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 45.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 22.7 | °C/W |