SBOS926H January   2021  – November 2024 OPA2392 , OPA392

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information - OPA392
    5. 6.5 Thermal Information - OPA2392
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Operating Voltage
      2. 7.3.2 Low Input Bias Current
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision G (April 2024) to Revision H (November 2024)

  • Changed status of OPA392 DCK (SC70, 5) and OPA2392 DSG (WSON, 8) packages from preview to production data (active) and added associated contentGo
  • Changed max VOS of OPA2392DGK for overtemperature range condition from ±125µV to ±180µV based on the latest characterization dataGo
  • Changed typical phase margin specification of OPA392YBJ and OPA2392D, DGK, and YBJ from 45° to 35° based on the latest characterization dataGo

Changes from Revision F (December 2023) to Revision G (April 2024)

  • Changed OPA2392 DGK (VSSOP, 8) package status from advanced information (preview with samples) to production data (active) and added associated contentGo

Changes from Revision E (September 2023) to Revision F (December 2023)

  • Changed OPA392 YBJ (DSBGA, 6) package status from advanced information (preview with samples) to production data (active) and added associated contentGo
  • Changed OPA2392 D (SOIC, 8) package status from preview to production data (active) and added associated contentGo
  • Changed OPA2392 DGK (VSSOP, 8) package status from preview to advanced information (preview with samples) and added associated contentGo