SBOSA93C May   2023  – June 2024 OPT4001-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Spectral Matching to Human Eye
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Error Correction Code (ECC) Features
        1. 6.3.3.1 Output Sample Counter
        2. 6.3.3.2 Output CRC
      4. 6.3.4 Output Register FIFO
      5. 6.3.5 Threshold Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
      2. 6.4.2 Interrupt Modes of Operation
      3. 6.4.3 Light Range Selection
      4. 6.4.4 Selecting Conversion Time
      5. 6.4.5 Light Measurement in Lux
      6. 6.4.6 Threshold Detection Calculations
      7. 6.4.7 Light Resolution
    5. 6.5 Programming
      1. 6.5.1 I2C Bus Overview
        1. 6.5.1.1 Serial Bus Address
        2. 6.5.1.2 Serial Interface
      2. 6.5.2 Writing and Reading
        1. 6.5.2.1 High-Speed I2C Mode
        2. 6.5.2.2 Burst Read Mode
        3. 6.5.2.3 General-Call Reset Command
        4. 6.5.2.4 SMBus Alert Response (USON Variant)
  8. 7 Register Maps
    1. 7.1 Register Descriptions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Electrical Interface
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Optical Interface
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Optomechanical Design (PicoStar Variant)
          2. 8.2.1.2.2 Optomechanical Design (USON Variant)
        3. 8.2.1.3 Application Curves (PicoStar Variant)
        4. 8.2.1.4 Application Curves (USON Variant)
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Soldering and Handling Recommendations (PicoStar Variant)
          1. 8.5.1.1.1 Solder Paste
          2. 8.5.1.1.2 Package Placement
          3. 8.5.1.1.3 Reflow Profile
          4. 8.5.1.1.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
          5. 8.5.1.1.5 Rework Process
        2. 8.5.1.2 Soldering and Handling Recommendations (USON Variant)
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.6 Timing Requirements

see (1)
MINTYPMAXUNIT
I2C FAST MODE
fSCLSCL operating frequency0.010.4MHz
tBUFBus free time between stop and start1300ns
tHDSTAHold time after repeated start600ns
tSUSTASetup time for repeated start600ns
tSUSTOSetup time for stop600ns
tHDDATData hold time20900ns
tSUDATData setup time100ns
tLOWSCL clock low period1300ns
tHIGHSCL clock high period600ns
tRC and tFCClock rise and fall time300ns
tRD and tFDData rise and fall time300ns
tTIMEOBus timeout period. If the SCL line is held low for this duration of time, the bus state machine is reset.28ms
I2C HIGH-SPEED MODE
fSCLSCL operating frequency0.012.6MHz
tBUFBus free time between stop and start160ns
tHDSTAHold time after repeated start160ns
tSUSTASetup time for repeated start160ns
tSUSTOSetup time for stop160ns
tHDDATData hold time20140ns
tSUDATData setup time20ns
tLOWSCL clock low period240ns
tHIGHSCL clock high period60ns
tRC and tFCClock rise and fall time40ns
tRD and tFDData rise and fall time80ns
tTIMEOBus timeout period. If the SCL line is held low for this duration of time, the bus state machine is reset.28ms
(1) All timing parameters are referenced to low and high voltage thresholds of 30% and 70%, respectively, of the final settled value.