SBOSA93C May   2023  – June 2024 OPT4001-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Spectral Matching to Human Eye
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Error Correction Code (ECC) Features
        1. 6.3.3.1 Output Sample Counter
        2. 6.3.3.2 Output CRC
      4. 6.3.4 Output Register FIFO
      5. 6.3.5 Threshold Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
      2. 6.4.2 Interrupt Modes of Operation
      3. 6.4.3 Light Range Selection
      4. 6.4.4 Selecting Conversion Time
      5. 6.4.5 Light Measurement in Lux
      6. 6.4.6 Threshold Detection Calculations
      7. 6.4.7 Light Resolution
    5. 6.5 Programming
      1. 6.5.1 I2C Bus Overview
        1. 6.5.1.1 Serial Bus Address
        2. 6.5.1.2 Serial Interface
      2. 6.5.2 Writing and Reading
        1. 6.5.2.1 High-Speed I2C Mode
        2. 6.5.2.2 Burst Read Mode
        3. 6.5.2.3 General-Call Reset Command
        4. 6.5.2.4 SMBus Alert Response (USON Variant)
  8. 7 Register Maps
    1. 7.1 Register Descriptions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Electrical Interface
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Optical Interface
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Optomechanical Design (PicoStar Variant)
          2. 8.2.1.2.2 Optomechanical Design (USON Variant)
        3. 8.2.1.3 Application Curves (PicoStar Variant)
        4. 8.2.1.4 Application Curves (USON Variant)
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Soldering and Handling Recommendations (PicoStar Variant)
          1. 8.5.1.1.1 Solder Paste
          2. 8.5.1.1.2 Package Placement
          3. 8.5.1.1.3 Reflow Profile
          4. 8.5.1.1.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
          5. 8.5.1.1.5 Rework Process
        2. 8.5.1.2 Soldering and Handling Recommendations (USON Variant)
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.5.1.2 Soldering and Handling Recommendations (USON Variant)

The OPT4001-Q1 is qualified for three soldering reflow operations as per JEDEC JSTD-020.

Note:

Excessive heat can discolor the device and affect optical performance.

See the QFN and SON PCB Attachment application note for details on the soldering thermal profile and other information. Discard the device and do not reattach if the OPT4001-Q1 must be removed from a PCB.

As with most optical devices, take special care to make sure that optical surfaces of the device stay clean and free from damage. See Section 8.3 for more detailed recommendations. For best optical performance, solder flux and any other possible debris must be cleaned after the soldering processes.

Figure 8-12 shows how to identify pin 1 on the bottom side of the package. Figure 8-13 shows various identification features for pin 1 on the top side of the package.

OPT4001-Q1 Identification Feature for Pin 1
NOTE: The bottom side of the device features an angled feature to denote pin 1.
Figure 8-12 Identification Feature for Pin 1
OPT4001-Q1 Identification Features for Pin 1 on the PackageFigure 8-13 Identification Features for Pin 1 on the Package