SBOSAA9A March 2023 – June 2024 TRF0208-SEP
ADVANCE INFORMATION
The TRF0208-SEP is available in a 2mm × 2mm, WQFN-FCRLF package that has excellent thermal properties. Connect the thermal pad underneath the chip to a ground plane. Short the ground plane to the other ground pins of the chip at four corners, if possible, to allow heat propagation to the top layer of PCB. Use a thermal via that connects the thermal pad plane on the top layer of the PCB to the inner layer ground planes to allow heat propagation to the inner layers.