SBOSAI0B December 2023 – September 2024 OPA310-Q1
PRODMIX
THERMAL METRIC (1) | OPA2310-Q1 | ||
---|---|---|---|
D (SOIC) |
DGK (VSSOP) |
||
8 PINS | 8 PINS | ||
RθJA | Junction-to-ambient thermal resistance | 139.0 | 187.7 |
RθJC(top) | Junction-to-case (top) thermal resistance | 81.2 | 78.1 |
RθJB | Junction-to-board thermal resistance | 82.4 | 109.5 |
ψJT | Junction-to-top characterization parameter | 31.3 | 17.9 |
ψJB | Junction-to-board characterization parameter | 81.6 | 107.9 |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A |