SBOU266B september   2021  – august 2023 TRF1208

 

  1.   1
  2.    TRF1208 Evaluation Module
  3.   Trademarks
  4. 1Description
    1. 1.1 Features
    2. 1.2 General Usage Information
  5. 2EVM Overview
    1. 2.1 Schematic
    2. 2.2 PCB Layers
    3. 2.3 TRF1208 EVM Bill of Material
    4. 2.4 Stack-Up and Material
  6. 3Test Setup Diagrams
    1. 3.1 S-Parameter Test Setup
    2. 3.2 Noise Figure Test Setup
    3. 3.3 Two-Tone OIP3 Test Setup
  7. 4Related Documentation
  8. 5Revision History

2.4 Stack-Up and Material

The TRF1208 EVM is a 67-mil, 4-layer board whose material type is Isola® 370HR. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at 50 Ω. The bottom 3 layers are ground layers.

GUID-20210809-SS0I-KSLZ-L2TV-CQ4W8P3RNWZJ-low.svgFigure 2-6 TRF1208 EVM Stack-Up (Units in Mils)