SBOU297A April   2024  – July 2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Additional Images
    2. 2.2 How to Setup
    3. 2.3 Assembly Instructions
    4. 2.4 Power Requirements
    5. 2.5 Setup
    6. 2.6 Header Information
    7. 2.7 Interfaces
    8. 2.8 Best Practices
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Revision History

1.2 Kit Contents

The orderable AMP-PDK-EVM contains only the main board. The daughtercard options for the different package variants are not included. Ordering the AMP-PDK-EVM main board with at least one daughtercard (Table 2-1) for full functionality is required. Devices must be ordered separately.

AMP-PDK-EVM Components Required for Device EvaluationFigure 1-1 Components Required for Device Evaluation

The available daughtercards with the package descriptions are listed in Table 2-1, showing each corresponding orderable part number, package family, TI package designator, number of channels, and pin count.

The shutdown and non-shutdown variants of a device are supported (as seen by the pin-count). An example is using the AMP-PDK-SC70-6 with the TLV9001 available in non-shutdown TLV9001IDCKR (SOT-SC70 (DCK) | 5) and in shutdown TLV9001SIDCKR (SOT-SC70 (DCK) | 6).

A device's package designators and pin count can be found on ti.com.

Table 1-1 AMP-PDK-EVM Daughtercard Options
Orderable Part NumberPackage FamilyTI Package DesignatorNo. Of Channels in DevicePin Count (Non-Shutdown | Shutdown Variant)
AMP-PDK-SC70-6

SOT-SC70

DCK

1

5 | 6

AMP-PDK-SOT23-6

SOT-23

DBV

1

5 | 6

AMP-PDK-VSSOP-8

VSSOP

DGK

2

8
AMP-PDK-SOIC-8

SOIC

D

2

8

AMP-PDK-SOIC-14

SOIC

D

4

14
AMP-PDK-TSSOP-14

TSSOP

PW

4

14