SBOU298 March   2024 INA4230 , INA4235

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Quick Start Setup
    2. 2.2 EVM Operation
      1. 2.2.1 Current Sensing Operation
        1. 2.2.1.1 Detailed Setup
    3. 2.3 Circuitry
      1. 2.3.1 Current Sensing IC
      2. 2.3.2 Input Signal Path
      3. 2.3.3 Digital Circuitry
    4. 2.4 PAMB Compatibility
  8. 3Software
    1. 3.1 Setup
      1. 3.1.1 Driver Installation
      2. 3.1.2 Firmware
        1. 3.1.2.1 Firmware Debug
      3. 3.1.3 GUI Setup and Connection
        1. 3.1.3.1 Initial Setup
        2. 3.1.3.2 GUI to EVM Connection
    2. 3.2 GUI Operation
      1. 3.2.1 Homepage Tab
      2. 3.2.2 Configuration Tab
      3. 3.2.3 Registers Tab
      4. 3.2.4 Results Data Tab
    3. 3.3 Direct EVM USB Communication
      1. 3.3.1 Standard USB Read and Write Operations
      2. 3.3.2 Collect Data Through the USB BULK Channel
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Related Documentation

PCB Layout

Note:

Board layouts are not to scale. These figures are intended to show how the board is laid out. The figures are not intended to be used for manufacturing EVM PCBs.

Figure 5-3 through Figure 5-6 illustrate the PCB layers of the EVM.

GUID-20240226-SS0I-T278-DZNW-NPSB9DBKCQ1H-low.svgFigure 4-3 SENS112 Top View
GUID-20240226-SS0I-ZTMR-GHR5-6XJJ0CCGH8Z3-low.svgFigure 4-5 SENS112 Bottom View
GUID-20240226-SS0I-VCHP-V8WM-4L7VN0ZCQ19N-low.svgFigure 4-4 SENS112 Top Layer
GUID-20240226-SS0I-MBRP-2PDB-NG49XQH1DJTS-low.svgFigure 4-6 SENS112 Bottom Layer