SBOU301A July   2023  – January 2024 LOG200

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Read this first: EVM Cleaning Guidelines
    2. 2.2 Input and Output Connections
    3. 2.3 Power Requirements
    4. 2.4 Jumper Information
    5. 2.5 Optional Photodiode Connections
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Revision History

1.4 Device Information

The EVM is built with the LOG200IRGT device in the 16-pin QFN package with the thermal pad.