SBVS037Q August 2003 – September 2024 TPS732
PRODUCTION DATA
THERMAL METRIC(1) | TPS732 M3 new silicon | UNIT | ||
---|---|---|---|---|
DRB (VSON) | DCQ (SOT-223) | |||
8 PINS | 6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 47.7 | 76 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 68.9 | 46.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 20.6 | 18.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 3.4 | 8.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 20.6 | 17.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.5 | N/A | °C/W |