SBVS383A December   2019  – March 2020 TLV752

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Input and Output Capacitor Selection
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Feed-Forward Capacitor (CFF)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

DSQ Package
10-Pin Adjustable WSON
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
EN1 3 Input Enable pin. Drive EN1 greater than VEN1(HI) to turn on the regulator.
Drive EN1 less than VEN1(LO) to put the low-dropout (LDO) regulator into shutdown mode.
EN2 5 Input Enable pin. Drive EN2 greater than VEN1(HI) to turn on the regulator.
Drive EN2 less than VEN2(LO) to put the LDO into shutdown mode.
FB1 1 — This pin is used as an input to the control loop error amplifier and is used to set the output voltage of the LDO.
FB2 7 — This pin is used as an input to the control loop error amplifier and is used to set the output voltage of the LDO.
GND 2, 4 — Ground pin
IN1 9 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the input capacitor as close to the output of the device as possible.
IN2 6 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the input capacitor as close to the output of the device as possible.
OUT1 10 Output Regulated output voltage pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the output capacitor as close to output of the device as possible.
OUT2 8 Output Regulated output voltage pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the output capacitor as close to output of the device as possible.
Thermal pad Pad — Connect the thermal pad to a large area GND plane for improved thermal performance.