SBVS424C December   2023  – October 2024 TLV773

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Active Discharge
      3. 6.3.3 Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.5 Electrical Characteristics

at operating temperature TJ = 25℃, VIN = VOUT(NOM) + 0.5V or 1.4V, whichever is greater, VEN = VIN, IOUT = 1mA, CIN = 1µF, and COUT = 1µF (unless otherwise noted); all typical values are at TJ = 25℃
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ΔVOUT
Output voltage tolerance		 0.6V ≤ VOUT < 1.8V –2.5 2.5 %
1.8V ≤ VOUT ≤ 3.3V –2 2
TJ = –40℃ to 85℃ 0.6V ≤ VOUT < 1.2V –3.33 3.33
1.2V ≤ VOUT < 1.8V –3 3
1.8V ≤ VOUT < 2.5V –2.75 2.75
2.5V ≤ VOUT ≤ 3.3V –2.5 2.5
ΔVOUT / ΔVIN Line regulation VIN = (VOUT(NOM) + 0.5V) to 5.5V 0.01 0.1 %/V
ΔVOUT / ΔIOUT Load regulation IOUT = 1mA to 300mA 85 110 µV/mA
IGND
Quiescent ground current		 VEN = VIN = 5.5V, IOUT = 0mA, TJ = –40°C to 85°C 80 120 µA
ISHDN Shutdown ground current VEN < VEN(LOW), VIN = 5.5V, TJ = –40°C to 85°C 0.01 2 µA
VDO Dropout voltage
 
IOUT = 300mA,
VIN = VOUT(NOM)  		 1.2V ≤ VOUT < 1.8V(1)(2) 600 mV
1.8V ≤ VOUT < 2.5V 330
2.5V ≤ VOUT < 2.8V 245
IOUT = 300mA,
VIN = VOUT(NOM),  
TJ = –40°C to 85°C 		 1.2V ≤ VOUT < 1.8V(1)(2) 680
1.8V ≤ VOUT < 2.5V 385
2.5V ≤ VOUT < 2.8V 285

IOUT = 300mA,
VIN = VOUT(NOM) 
 		 2.8V ≤ VOUT ≤ 3.3V, DBV package 200 230
2.8V ≤ VOUT ≤ 3.3V, DQN package 180 210
IOUT = 300mA,
VIN = VOUT(NOM),  
TJ = –40°C to 85°C 		 2.8V ≤ VOUT ≤ 3.3V, DBV package 270
2.8V ≤ VOUT ≤ 3.3V, DQN package 245
ICL Output current limit VOUT = 0.9 x VOUT(NOM), TJ = –40°C to 85°C 350 720 mA
ISC Short-circuit current limit VOUT = 0V 65 mA
PSRR Power-supply rejection ratio IOUT = 1mA,
VIN = VOUT + 1.0V		 f = 217Hz 80 dB
f = 1kHz 72
IOUT = 50mA,
VIN = VOUT + 1.0V		 f = 100kHz 56
f = 1MHz 55
VN Output noise voltage BW = 10Hz to 100kHz, IOUT = 50mA 75 x VOUT µVRMS
RPULLDOWN Output automatic discharge pulldown resistance VEN < VEN(LOW) (output disabled), VIN = 3.3V 135 Ω
TSD Thermal shutdown TJ rising 160 °C
TJ falling 140
VEN(LOW)  Low input threshold VEN falling until the output is disabled.  TJ = –40°C to 85°C 0.3 V
VEN(HI)  High input threshold VEN rising until the output is enabled.  TJ = –40°C to 85°C 0.9 V
IEN EN input leakage current VEN = 5.5V and VIN = 5.5V 0.01 1 µA
(1) For VOUT < 1.4V, dropout is tested with VIN = 1.4V.
(2) For VOUT = 0.6V, Dropout voltage < Headroom voltage. At VIN = 1.4V, a 0.6V output device is not in dropout. Headroom voltage = VIN - VOUT.