SCAS519G July   1995  – July 2024 SN54AC04 , SN74AC04

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device and Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Recommended Operating Conditions

over recommended operating free-air temperature range (unless otherwise noted)(1)
SN54AC04 SN74AC04 UNIT
MIN MAX MIN MAX
VCC Supply voltage 2 6 2 6 V
VIH High-level input voltage VCC = 3 V 2.1 2.1 V
VCC = 4.5 V 3.15 3.15
VCC = 5.5 V 3.85 3.85
VIL Low-level input voltage VCC = 3 V 0.9 0.9 V
VCC = 4.5 V 1.35 1.35
VCC = 5.5 V 1.65 1.65
VI Input voltage 0 VCC 0 VCC V
VO Output voltage 0 VCC 0 VCC V
IOH High-level output current VCC = 3 V –12 –12 mA
VCC = 4.5 V –24 –24
VCC = 5.5 V –24 –24
IOL Low-level output current VCC = 3 V 12 12 mA
VCC = 4.5 V 24 24
VCC = 5.5 V 24 24
∆t/∆v Input transition rise or fall rate 8 8 ns/V
TA Operating free-air temperature –55 125 –40 85 °C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.